The effect of polishing time, polishing speed, and applied force on the reduction of roughness values on the surface of silicon photovoltaic wafers

Ronald Allan S. de los Reyes

Abstract


The shaping of silicon through a series of machining processes is a very important part in the transformation of this material into useful devices.

Keywords


Ductile; brittle; roughness; transition; force; polishing speed

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Copyright (c) 2015 Ronald Allan S. de los Reyes

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